Fab Synchronization for producing advanced chips

27 June 2010

Four reputed companies have come together to synchronize semiconductor manufacturing program for producing advanced chips based on 28nm process technology. IBM, Samsung Electronics, ST Microelectronics and Global Foundries are working towards standardization of advanced 28nm process technology so those consistent products are made worldwide for various applications including electronics and device manufacturers.

The 28nm process technology, which was jointly developed by IBM Technology Alliance is designed for the next generation smart mobile devices enabling them to operate at higher speed. The additional features of these devices will also be compact size, longer battery life and low standby power. The base 28nm technology is also expected to be foundation for many portable new generation electronics devices that are capable of streaming video, data, voice etc.

The members of the technology alliance include Infineon Technology, Renesas Electronics, Toshiba in addition to the other four members. The 28nm chips is designed to use complimentary metal oxide semiconductor (CMOS) and high K metal oxides (HKMG) processes and the above members are now working towards the global standards for HKMG process with “Gate First” technology. The approach is much more superior to the conventional approach and will offer a smaller size and compatible with the other parameters of the process.

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