IBM Creates First Self-Assembling Nanochip

4 May 2007

IBM has used Nanotechnology to create the Airgap computer chip, the size of a mere thumbnail. Borrowing on one of Nanotechnology’s core tenets, it exploits the principle of self-assembly by creating millions of Nano-scale holes on the wafer. Vacuums created around wires act as a conductor for electricity, resulting in a faster and more efficient flow of electrical current.

The self-assembly process is much more effective than the current lithographic techniques which rely on etching onto the wafer to create the chip design. Rather, IBM engineers pour a mixture of compounds onto a wafer with the wire patterns, and a self-assembling process takes place whereby the compounds create trillions of Nanoscale holes. After the baking process is complete the resulting holes create vacuums—hence the term “air gap”—which conduct electricity throughout the computer chip

Laboratory benchmarks conducted on the new chip demonstrate that electrical signals flow 35 percent faster and use 15 percent less electricity than even the most advanced computer chips presently on the market.

The beauty of this Nanotechnology-enabled technological marvel is that it can be used with existing CMOS computer products. Thus, cost—and time—to market is significantly reduced. IBM has already begun using the self-assembly process in some of its manufacturing and expects to have the chips operational in server product lines by 2009.

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One Response to “IBM Creates First Self-Assembling Nanochip”

  1. On May 29th, 2007 at 4:43 pm, Anonymous Says:

    Please note that a vacuum is generally regarded as an electrical insulator. To the best of my understanding, the “air gaps” mediate leakage currents that would interfere with chip operation. Thanks!

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