Copper Nanorods help in boosting boiling efficiency
7 July 2008A new study lead by Nikhil A. Koratkar, associate professor and his team of researchers at Rensselaer Polytechnic Institute have shown that by depositing invisible layer of copper nanorod at the bottom of any metallic vessel, less heat is required to boil the water. According to the researchers, less energy is required for boiling water and it could have been resulted from the interaction between nanoscale and microscale layers.
This particular study could have long lasting impact on a number of technologies including impact on boiling application required by various industries, reduce energy loss in heat transfer systems and improve cooling efficiency of computer chips.
Bubble formation in heating water takes place when air is trapped in cavity on any metalic surface and vapor pressure releases the bubble from cavity and forces it towards the top of the metallic vessel and as a result cavity is filled by water.
Researchers filled these nanoscale cavities with copper nanorods and thus disallowing trapped air to release from cavities, which promoted in faster boiling of water. Researchers observed that a 30-fold increase in active bubble density, which resulted in faster and significantly improved boiling.
Related Posts:
- New purifying methods for gold nanorods developed
- Use of carbon nanotubes in conductors
- Optical and elastic properties of Metal Nanoparticles
- Improving Nanotube Florescence
- Nanotechnology Increases Efficiency of Plastic Solar Cells
- Nanotechnology Boosts Electron Microscope Demand
- Nanoparticle created for Tumor Imaging
- Nanotechnlogy based tinniest refrigerator
- New technique developed to study superconductivity
- Introduction to Nanocrystalline Diamond
Top Of Page | Trackback
If you found this page useful, consider linking to it. Simply copy and paste the code below into your web site.
It will look like this: Copper Nanorods help in boosting boiling efficiency
